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| LX7206 TM (R) Integrated EMI Filter & ESD Protection for Earpiece Speaker & Microphone Ports PRODUCTION DATA SHEET DESCRIPTION KEY FEATURES Flip Chip construction Bi-directional EMI/RFI low-pass filter ESD protection with integrated line termination resistor Bi-directional TVS protects against negative ESD voltages in audio applications Low TVS operating voltage (5.0V) Low leakage current 0.5mm Pitch Chip Scale Package designed for direct assembly on FR4 PCB using conventional assembly techniques APPLICATIONS WWW .Microsemi .C OM Proliferation of digital portable electronic equipment has created a noisy environment in which all devices become susceptible to Electromagnetic Interference (EMI). Interference form cell phone frequencies of 800-900 MHz and 1.9GHz as well as the growing wireless LAN frequencies of 2.46GHz can couple into the audio port of a handheld device and adversely affect its performance. FCC Part 15 sets maximum allowable emission and immunity levels for all digital devices. LX7206 is an integrated low pass filter with ESD protection that filters out the undesired frequencies as well as protecting the port against both positive and negative ESD voltages. The device is a 3x2 array flip chip and measures 1.5 x 1.0 x 0.65 mm. The small size and profile of this device is ideally suited for portable applications. The absence of leadframe and bondwires minimizes inductance and optimizes the high frequency filter performance. LX7206 exceeds the requirements of IEC61000-4-2 (15KV air discharge and 8KV contact discharge). IMPORTANT: For the most current data, consult MICROSEMI's website: http://www.microsemi.com BENEFITS Filter response characterized up to 6 GHz Low insertion loss in the pass band >20dB attenuation in the 800-900 MHz range >15dB attenuation in the WLAN frequencies of 2.4GHz and 5.0-6.0 GHz Cell phones and Accessories Personal Digital Assistants (PDA's) Pagers MP3 Players Desktops and Notebook Computers Digital Camcorders PRODUCT HIGHLIGHT Device Schematic A1 10 B1 Earpiece Input C C Earpiece Output B GND A2, B2 A3 68 B3 A C Microphone Input C Microphone Output 1 2 3 LX7206 LX7206 GND A2, B2 PACKAGE ORDER INFO TJ (C) -40 to 125 SP 0.5mm Pitch Chip Scale Package (CSP) LX7206ISP Note: Available in Tape & Reel. Append the letters "TR" to the part number. (i.e. LX7206ISP-TR) Copyright (c) 2004 Rev. 1.0, 2004-10-05 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 1 LX7206 TM (R) Integrated EMI Filter & ESD Protection for Earpiece Speaker & Microphone Ports PRODUCTION DATA SHEET ABSOLUTE MAXIMUM RATINGS PACKAGE PIN OUT Peak Pulse Power (tp = 8/20 s ) IEC61000-4-5 .......................................... 250W Peak Pulse Current (tp = 8/20 s ) IEC61000-4-5 ...........................................26A ESD Air Discharge per IEC61000-4-2 ......................................................... 30KV ESD Contact Discharge per IEC61000-4-2 .................................................. 30KV Operating Temperature ................................................................-40C to +125C Storage Temperature Range.........................................................-55C to +150C Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of specified terminal. SP PACKAGE (Top View) WWW .Microsemi .C OM FUNCTIONAL PIN DESCRIPTION Name A1 B1 A2 & B2 A3 B3 Line 1 input Line 1 output Ground Line 2 input Line 2 output Description ELECTRICAL CHARACTERISTICS y Unless otherwise specified, the following specifications apply over the operating ambient temperature 0C TA otherwise noted. Parameter SECTION HEADER 70C except where Symbol VRWM VBR IR RS RS TCOEFF C C Test Conditions Min LX7206 Typ Max 5.0 Units V V A ppm pF pF Stand-Off Voltage Breakdown Voltage Leakage Current Series Resistance, A1 to B1 Series Resistance, A3 to B3 Temperature Coefficient of RS Capacitor, A1 or B1 to GND Capacitor, A3 or B3 to GND IR = 1mA VRWM = + -5.0V, T = 25C 6 -1 9 61 115 115 Each Line VR = 2.5V, f = 1 MHz VR = 2.5V, f = 1 MHz 10 68 200 145 145 1 11 75 175 175 ELECTRICALS ELECTRICALS Copyright (c) 2004 Rev. 1.0, 2004-10-05 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 2 LX7206 TM (R) Integrated EMI Filter & ESD Protection for Earpiece Speaker & Microphone Ports PRODUCTION DATA SHEET RECOMMENDED PCB PARAMETERS WWW .Microsemi .C OM Parameter Cu pad size Pad Pitch Pad Definition Solder Mask Opening Solder Stencil Pad Protective Finish 0.275 +0.0/-0.025 mm 0.5mm Value Non-Solder Mask Defined 0.325 0.025 mm 0.25 x 0.25 mm square, 0.125 mm thick, laser cut, electro-polished OSP (Organic Surface Preservative) Non-Solder Mask Defined Cu Pad (OSP finish) 0.275 mm dia. Solder Mask Opening 0.325 mm dia. Figure 1 - Recommended Non-Solder Mask Defined Pad 240 oC max Temperature (oC) 183 oC 150 oC P D PACKAGE DATA Preheat Zone Flux Activation Zone Solder Reflow Zone Cooling Zone ~ 1min ~2 min ~ 1min Time (s) Figure 2 - Solder Reflow Profile. Maximum temperature is 240C and maximum time above liquidous (183C) is 60 seconds. Copyright (c) 2004 Rev. 1.0, 2004-10-05 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 3 LX7206 TM (R) Integrated EMI Filter & ESD Protection for Earpiece Speaker & Microphone Ports PRODUCTION DATA SHEET TEK Preview Single Seq 8KV Contact ESD 0 Acqs TEK Stopped Single Seq 1Acqs WWW .Microsemi .C OM 5.0V M 40.0ns Ch1 5.0V M 40.0ns Chart 1 - 8KV ESD input pulse as per IEC61000-4-2. Vertical scale is equivalent to 5A/div. Chart 2 - Clamping characteristics when device subjected to an 8KV ESD pulse. S21 0 dB log 5dB/ REF 0dB 0 dB S21 log 5dB/ REF 0dB -10 dB -10 dB Insertion Loss Insertion Loss 0.3 1 10 1000 6000 -20 dB -20 dB -30 dB -30 dB -40 dB -40 dB 100 0.3 1 10 100 1000 6000 Frequency (MHz) Chart 3 - Typical frequency response curce of the EMI filter (A1-B1) Frequency (MHz) Chart 4 - Typical frequency response curve of the EMI filter (A3-B3) 14 Clamping Voltage VC(V) 12 10 8 C CHARTS 6 Line To GND 4 2 0 0 5 10 15 20 Peak Pulse Current IPP(A) 25 30 GND to Line Chart 5 - Clamping voltage versus Peak Pulse Current. Waveform parameters: tr = 8s, td = 20s. Per IEC61000-4-5 Copyright (c) 2004 Rev. 1.0, 2004-10-05 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 4 LX7206 TM (R) Integrated EMI Filter & ESD Protection for Earpiece Speaker & Microphone Ports PRODUCTION DATA SHEET PACKAGE DIMENSIONS WWW .Microsemi .C OM SP 0.5mm Chip Scale Package 1.5mm 0.5mm 0.25mm dia. 63/37 Sn/Pb Eutectic Solder Bumps Pin A1 Identification Mark B 0.5mm 1.0 mm A 1 2 3 SP Package - Bumps Up 06 YWWA Y = Year | WW = Work Week | A = Lot Code SP Package - Bump Side Down Copyright (c) 2004 Rev. 1.0, 2004-10-05 YWWA YWWA YWWA 06 Device Orientation in Tape Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 06 06 MECHANICALS MECHANICALS Page 5 LX7206 TM (R) Integrated EMI Filter & ESD Protection for Earpiece Speaker & Microphone Ports PRODUCTION DATA SHEET TAPE SPECIFICATIONS WWW .Microsemi .C OM A C B J L P D E F K 5M A X H G Dim A B C D E F G H J K L MILLIMETERS MIN MAX 3.90 4.10 1.95 2.05 1.65 1.85 3.45 3.55 1.90 2.10 0.67 0.77 1.03 1.13 1.75 1.85 1.40 1.60 0.45 0.55 0.252 0.256 MECHANICALS MECHANICALS Copyright (c) 2004 Rev. 1.0, 2004-10-05 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 6 LX7206 TM (R) Integrated EMI Filter & ESD Protection for Earpiece Speaker & Microphone Ports PRODUCTION DATA SHEET NOTES WWW .Microsemi .C OM N NOTES PRODUCTION DATA - Information contained in this document is proprietary to Microsemi and is current as of publication date. This document may not be modified in any way without the express written consent of Microsemi. Product processing does not necessarily include testing of all parameters. Microsemi reserves the right to change the configuration and performance of the product and to discontinue product at any time. Copyright (c) 2004 Rev. 1.0, 2004-10-05 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 7 |
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